The 2023 World Semiconductor Conference and Nanjing International Semiconductor Expo, opened on 20 July, explored future markets and industry opportunities. Focusing on EDA software, third-generation semiconductors, artificial intelligence and computing power chips, and make breakthroughs in key core technologies, Nanjing announced to build a third-generation semiconductor industry base duing the conference.

The National Integrated Circuit Design Automation Technology Innovation Center, the country’s first national technology innovation center in the field of integrated circuit design, has officially settled in Nanjing Jiangbei New District in June.

More than 300 high-quality enterprises from the upstream and downstream of the industrial chain, such as TSMC, Huatian Technology Co. LTD., Tongfu Microelectronics Co. LTD., Changjing Electronics Technology Co. LTD., Xinhua Semiconductor Materials Technology Co. Ltd., Huawei, Tencent Cloud participated in the Expo, which contributed to more than 500 cooperation intentions in the semiconductor industry.

The summit also held professional exhibitions by setting up four key exhibition areas for IC design, packaging testing, manufacturing, equipment and materials, as well as a talent zone. The companies at the summit showcased the latest advanced technologies and high-end products in the semiconductor industry.